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Polymer & materials science hiring snapshot · last 8 months
38Open roles
$60–375KSalary range
21.5Roles / month
98%H-1B signals
BachelorTypical degree
1 to 2 monthsHow long roles stay open, typically
Open roles (38)
- Advanced Packaging Process Engineer Phoenix, AZ· $115k – $220k
- WATD Module Development Engineer Hillsboro, OR· $156k – $298k
- Senior Thin Films Metals Deposition Engineer Hillsboro, OR· $134k – $255k
- Packaging Module Development Engineer Hillsboro, OR· $115k – $220k
- Intel Foundry Process Development Engineer - Lithography Hillsboro, OR· $134k – $255k
- Substrate Packaging Research and Development Engineer Phoenix, AZ· $134k – $189k
- Advanced Packaging Module Development Engineer Hillsboro, OR· $134k – $255k
- Technology Research 2D Transistor Engineer Intern Hillsboro, OR· $121k – $121k
- NMSI F11x Thin Films Senior Module Engineer Albuquerque, NM· $121k – $171k
- Intel Foundry Process Development Engineer - Advanced Lithography Hillsboro, OR· $134k – $189k
- Senior Silicon Photonics Reliability Engineer Albuquerque, NM· $122k – $232k
- Back End( BE) Process Integration Engineer Hillsboro, OR· $104k – $171k
- Module Engineering PhD Intern Summer 2027 Hillsboro, OR· $121k – $121k
- Module Engineer Phoenix, AZ· $121k – $232k
- Module Engineering PhD Intern Phoenix, AZ· $121k – $121k
- Semiconductor Packaging Integration Research Manager Phoenix, AZ· $221k – $312k
- Module Engineering PhD Intern New 2027 Hillsboro, OR· $121k – $121k
- NMSI F11X Thin Films Module Engineer-Technologist Albuquerque, NM· $164k – $232k
- Substrate Quality and Reliability Engineer Phoenix, AZ· $104k – $199k
- Module Engineering PhD Intern - Wet Etch Hillsboro, OR· $121k – $121k
- Packaging Module Development Engineer Phoenix, AZ· $134k – $189k
- Quantum Cryoprober Engineer Hillsboro, OR· $142k – $269k
- Semiconductor Research Integration Engineer Hillsboro, OR· $142k – $200k
- Manufacturing and Process Development - Intern, Graduate Hillsboro, OR· $89k – $89k
- Manufacturing and Process Development - Intern, Bachelor’s Hillsboro, OR· $76k – $76k
- NMSi Module Engineer Albuquerque, NM· $104k – $146k
- Transistor Reliability and Quality Engineer Hillsboro, OR· $156k – $220k
- Back-End TD Reliability Lab Manager Phoenix, AZ· $181k – $255k
- Material Analysis Lab Technician Hillsboro, OR· $60k – $85k
- Thin Films Module Development Engineer Hillsboro, OR· $134k – $189k
- Ocotillo Technology Fabrication DSIRE (Diffusion) Module Engineer Phoenix, AZ· $89k – $171k
- Silicon Photonics Component Design Engineer Albuquerque, NM· $142k – $269k
- Ocotillo Failure Analysis Engineer – TEM/Probing Engineer Phoenix, AZ· $104k – $171k
- Principal Engineer, Module Development – CMP Hillsboro, OR· $211k – $298k
- Director, Process Engineer – Dry Etch Hillsboro, OR· $211k – $298k
- Staff Chemical Mechanical Planarization (CMP) Engineer Hillsboro, OR· $134k – $255k
- OTF Failure Analysis Technician - Night Shift Phoenix, AZ· $60k – $100k
- Principal Engineer, Hybrid Bonding Module Hillsboro, OR· $211k – $298k
Posted again and again
- Module Development Engineerlisted in 3 different months since March 2026
- Packaging Module Development Engineerlisted in 3 different months since April 2026
- Packaging Research and Development Engineerlisted in 3 different months since March 2026
Degree requirements
Top material classes
Most-requested techniques
Role mix
Where they hire
Industries
Work arrangement
72%On-site
28%Hybrid
2%Relocation
Visa & eligibility signals
YesH-1B filing history
4%Need clearance
1%Export-controlled
Sponsorship signals come from posting language plus historical DOL Labor Condition Application data. Confirm specifics with the recruiter.
H-1B filings for scientists and engineers
Intel filed 974 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025, at a median filed pay of $124K a year.
| Title filed | Filings | Median filed pay |
|---|---|---|
| Process Engineer | 785 | $113K |
| Engineering Manager | 39 | $182K |
| Quality Reliability Engineer | 25 | $109K |
| Industrial Engineer | 22 | $96K |
| SOC Design Engineer | 11 | $183K |
| Packaging Engineer | 9 | $133K |
By occupation: Materials engineers 794 · Engineering managers 120 · Industrial engineers 58 · Mechanical engineers 2. Worksites: OR 683 · NM 101 · AZ 96.
From U.S. Department of Labor Labor Condition Application disclosure data, certified filings only, in chemist, materials, chemical and mechanical engineering, physics, R&D management and science faculty occupations. A filing is a record of past hiring, not a promise about any role. Pay shown needs 3 filings. Compare every employer's filings.
Posting volume · last 8 months
Mar '26Apr '26May '26Jun '26Jul '26Aug '26Sep '26Oct '26
172 roles posted across 8 months, averaging 21.5/month.
