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Module Engineering PhD Intern New 2027

Intel · Hillsboro, OR3w agoverified 21 h ago
$121k – $121k

PhD-level Process Engineering roles on Crosslinked list a median of $129k (10 that show pay).

Develop and characterize metal thin-film deposition processes for semiconductor manufacturing modules.

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Worth knowing

Why it is interesting. Hands-on fab experience with ALD/CVD/PVD and advanced characterization in Intel's Logic Technology Development metals team.

Might not be for you. Internship role focused on process engineering, not open-ended materials R&D; requires cleanroom fab work.

Mostly at the benchHands-on execution PhD-friendlyInternship-friendly

Adjacent materials rolethin films materials deposition techniques (ALD, CVD, PVD or electroplating) and characterization (ellipsometry, XRF, XPS, XRR, 4-point probe, AFM, SEM, TEM)

H-1B filings

Intel filed 974 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Process Engineer, Engineering Manager, Quality Reliability Engineer. Median filed pay: $124K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority
Intern/Co-op
Work
On-site
Type
Internship
Degree
PhD
Industry
Semiconductor
Role
Process Engineering
Benefits
stock bonuses

Role details

Job Details: Job Description: As one of the world's largest chip manufacturers, and a global leader in innovative technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world-class Supply Chain and facilities support. Join us at Intel Foundry Logic Technology Development (LTD) for a Graduate internship and participate in creating the next generation of technologies that will shape the future for decades to come. LTD intern would conduct scientific research to enable manufacturing of innovative device architectures.

They would engage in designing, executing and analyzing experiments necessary to meet engineering specifications for their process, and participate in process and equipment development. The Role and Impact In this role, you will contribute to module process development, process integration flows, and equipment configuration for manufacturing modules. Work may also include support for yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments.

You will work in collaboration with engineering teams to optimize metrology strategies, troubleshoot process flow issues, and continuously improve the process in preparation for high-volume manufacturing environment. As an intern, you will have an opportunity to learn and apply your knowledge, build skills, and explore future career opportunities through hands-on experience and projects that support Intel business goals in a collaborative environment. Business group As part of Intel Foundry, you will join Logic Technology Development (LTD) Metals team that focuses on Metals Thin Films Deposition within semiconductor manufacturing.

The Logic Technology Development (LTD) organization delivers the latest process technology innovations to drive Intel's product roadmap. We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. The team supports Intel's broader mission of driving innovation and delivering high-quality solutions to meet global technological demands.

Key Responsibilities

Contribute to process development, continuous improvement, and implementation of semiconductor manufacturing processes for a specific module within LTD Metals. to help develop and improve our processes Design, execute, analyze experiments and present conclusions and recommendations to the group Collaborate with fab technicians and support experiment execution with clear instructions Assist engineering teams in process flow troubleshooting and metrology optimization strategies Apply statistical analysis and design experiments to enhance process reliability and throughput.

Gain experience in materials and device characterization techniques, such as ellipsometry, xray-based techniques, 4-point probe, AFM, SEM and TEM.

Qualifications

Minimum Qualifications

PhD student in Chemical Engineering, Electrical Engineering, Material Science, Physics, Chemistry, Mechanical Engineering, or a related field of study. Knowledge of semiconductor processing fundamentals, including thin films deposition, lithography, etching, polishing.

Experience in thin films materials deposition techniques (ALD, CVD, PVD or electroplating) and characterization (ellipsometry, XRF, XPS, XRR, 4-point probe, AFM, SEM, TEM, etc.), hands-on lab/fab equipment experience Data analysis skills with demonstrated ability to construct clear data-based problem statements, design of experiment Preferred Qualifications PhD student 3rd or 4th year; experience with thin film deposition and characterization If you're eager to advance your expertise in semiconductor technology, collaborate in a supportive environment, and contribute to innovative solutions that shape the future of manufacturing, we encourage you to consider this opportunity.

Job Type: Student / Intern Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry.

It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel . Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

Work Model for this Role This role will require an on-site presence. • Job posting details (such as work model, location or time type) are subject to change. • ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Related roles

Common questions

What is the salary for the Module Engineering PhD Intern New 2027 role at Intel?

The listed annual base salary range is $121K–$121K. This figure is taken from the posting itself.

Does Intel sponsor H-1B visas?

Intel has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Module Engineering PhD Intern New 2027 role. Confirm with the employer before applying if visa support is required.

Where is the Module Engineering PhD Intern New 2027 role at Intel based?

This role is based in Hillsboro, OR.

What degree is required for the Module Engineering PhD Intern New 2027 role at Intel?

This role requires a PhD.

What polymers or materials does this Module Engineering PhD Intern New 2027 role work with?

thin films, metals.

What techniques or methods are required for this Module Engineering PhD Intern New 2027 role?

ellipsometry, XRF, XPS, 4-point probe, AFM.