MTMicron Technology
Polymer & materials science hiring snapshot · last 8 months
Open roles (41)
- ID1 Photolithography Process Engineer Boise, ID
- Semiconductor Process Engineer Boise, ID
- Staff Process Engineer, Advanced Packaging CMP Boise, ID
- MTS Process Integration Engineer | APTD Die Level Technology Boise, ID
- Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding) Boise, ID
- New College Grad - PCVD Process Engineer Boise, ID
- Senior Engineer, Device Characterization Boise, ID
- New College Grad - Photolithography MDE Shift Engineer Boise, ID
- DMTS Process Development Engineer, Advanced Packaging Boise, ID
- CMP Process Development R&D Engineer Boise, ID
- Intern - Semiconductor Research & Technology Development Albany, NY
- Intern - Photomask Sustaining Engineering Boise, ID
- New College Grad - Shift Process Engineer ID1 Boise, ID· $31k
- Intern - EUV Lithography Boise, ID
- Principal RDA Process Engineer Boise, ID
- New College Grad - Photolithography Process Engineer Boise, ID
- Staff Process Engineer, APTD Bonding Boise, ID
- Process Engineer Manassas, VA
- Principal Engineer, RET Design Boise, ID
- Intern - ADV DRAM Process Integration Engineer Boise, ID
- Yield Enhancement Senior Failure Analysis Shift Technician Boise, ID
- Intern - Process Development Engineer, 3D DRAM CMP Boise, ID
- Intern - Process Development Engineer, 3D DRAM Photo Boise, ID
- 2027 Summer Intern: Advanced Spectroscopy and Nanoscale Materials Characterization Boise, ID
- Intern - Photomask Wet Process Engineering Boise, ID
- Principal Photonics Integration Engineer Boise, ID
- Intern - Advanced DRAM Process Integration Boise, ID
- Senior/Staff/Principal Package Design Engineer Boise, ID
- Intern - Wet Etch Process Development Engineer Boise, ID
- Intern - EUV & Materials Lithography Boise, ID
- Dry Etch MDE Shift Engineer Boise, ID
- Intern - Wafer Bonding Process Development Boise, ID
- Intern - DRAM Process Integration Boise, ID
- Intern - Process Pathfinding, DRAM Dry Etch Boise, ID
- R&D Thin Films Process Development Engineer Advanced DRAM Boise, ID
- Intern - Process Development Engineer, 3D DRAM Dry Etch Boise, ID
- Intern - Process Development Engineer, Dry Etch Boise, ID
- Dry Etch Module Technical Staff- MTS/SMTS Boise, ID
- TD CVD/DIFF/IMPLANT Process MDE Manager (Process Development Support) Boise, ID
- Sr BEOL Engineer - DRAM Process Integration Boise, ID
- Films Process Development Engineer Boise, ID
Degree requirements
Top material classes
Most-requested techniques
Role mix
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Work arrangement
Visa & eligibility signals
Sponsorship signals come from posting language plus historical DOL Labor Condition Application data. Confirm specifics with the recruiter.
H-1B filings for scientists and engineers
Micron Technology filed 201 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025, at a median filed pay of $118K a year.
| Title filed | Filings | Median filed pay |
|---|---|---|
| Semiconductor Process Engineer | 15 | $95K |
| Equipment Engineer | 12 | $104K |
| Fab Engineer | 7 | $115K |
| Process Development Engineer | 6 | $122K |
| Industrial Engineer | 5 | $108K |
| Supply Chain Engineer | 4 | $97K |
By occupation: Industrial engineers 89 · Materials engineers 42 · Mechanical engineers 35 · Chemical engineers 20. Worksites: ID 145 · VA 36 · CA 10.
From U.S. Department of Labor Labor Condition Application disclosure data, certified filings only, in chemist, materials, chemical and mechanical engineering, physics, R&D management and science faculty occupations. A filing is a record of past hiring, not a promise about any role. Pay shown needs 3 filings. Compare every employer's filings.
Posting volume · last 8 months
72 roles posted across 8 months, averaging 9/month.
