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Staff Process Engineer, APTD Bonding

Micron Technology · Boise, ID1mo agoverified 20 h ago

BS-level Process Engineering roles on Crosslinked list a median of $112k (561 that show pay). This posting does not list pay.

Develop and optimize advanced packaging bonding processes for memory products

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Worth knowing

Why it is interesting. Work at the front end of advanced packaging for AI-driven memory, collaborating with global R&D and materials suppliers.

Might not be for you. Requires 5+ years semiconductor process experience; cleanroom-heavy and focused on yield/defect work rather than open-ended materials R&D.

Bench and deskDeep specialist Senior hires only

Adjacent materials roleDevelop new or modified process formulations... material evaluation / optimization... new process, tools, and/or materials for new product introduction

H-1B filings

Micron Technology filed 201 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Semiconductor Process Engineer, Equipment Engineer, Fab Engineer. Median filed pay: $118K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority
Senior
Work
On-site
Type
Full-time
Degree
BS
Experience
5+ yrs
Industry
Semiconductor
Role
Process Engineering
Benefits
equity/stockpaid family leave

Role details

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information.

Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Position Overview: As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability.

This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process-related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

Responsibilities

Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods Identify, diagnose, and resolve assembly process related problems Coordinate and complete process, equipment, and material evaluation / optimization initiatives and implement changes at process step Validate and fan out new process baseline qualified, including new process, tools, and/or materials for new product introduction Support SPC/FDC/RMS/APC, and site-to-site portability Audit material suppliers to achieve quality, cost and risk management objectives Minimum Qualifications: BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics + 5 years of relevant industry experience Knowledge of Advanced Package Integration and DRAM, NAND, or other memory products Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), defect analysis and data analysis Experience in semiconductor process engineering and packaging with fundamental understanding of incoming and outgoing process and equipment interactions Ability to resolve sophisticated issues through root-cause or model-based problem solving and adjust to shifting responsibilities and needs of the team.

Preferred Qualifications

MS or PHD in Materials Science, Chemical Engineering, Electrical Engineering, or Mechanical Engineering Experience leading project teams and providing leadership updates Experience building relationships with suppliers/vendors As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.

Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits . Micron is proud to be an equal opportunity workplace and is an affirmative action employer.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here.

To learn more about Micron, please visit micron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert : Candidates are encouraged to use AI tools to enhance their resume and/or application materials.

However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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Common questions

Does Micron Technology sponsor H-1B visas?

Micron Technology has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Staff Process Engineer, APTD Bonding role. Confirm with the employer before applying if visa support is required.

Where is the Staff Process Engineer, APTD Bonding role at Micron Technology based?

This role is based in Boise, ID.

What degree is required for the Staff Process Engineer, APTD Bonding role at Micron Technology?

This role requires a BS.

How many years of experience does this Staff Process Engineer, APTD Bonding role require?

The posting calls for at least 5 years of relevant experience.

What techniques or methods are required for this Staff Process Engineer, APTD Bonding role?

DOE, SPC, defect analysis, FMEA, 8D.