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Sr BEOL Engineer - DRAM Process Integration

Micron Technology · Boise, ID1mo agoverified 14 h ago

BS-level Process Engineering roles on Crosslinked list a median of $112k (561 that show pay). This posting does not list pay.

Develop and optimize DRAM BEOL process flows: metallization, dielectrics, etch, CMP integration

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Worth knowing

Why it is interesting. Early-career entry into advanced DRAM BEOL integration with pathfinding on next-gen interconnect materials and architectures

Might not be for you. Fab-based integration role heavy on data analysis and yield troubleshooting — not formulation or polymer R&D; cleanroom gowning required

Bench and deskGeneralistFast-paced PhD-friendlyFirst industry roleBS acceptable Realistic requirements

Adjacent materials roleBEOL process integration, metallization, interconnects, dielectrics, barrier/liner films; CVD, ALD, PVD deposition; CMP

H-1B filings

Micron Technology filed 201 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Semiconductor Process Engineer, Equipment Engineer, Fab Engineer. Median filed pay: $118K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority
Entry level
Work
On-site
Type
Full-time
Degree
BS
Experience
0+ yrs
Industry
Semiconductor
Role
Process Engineering
Materials
Benefits
equity/stock

Role details

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global DRAM leader whose innovative designs are pushing the boundaries of what's possible in the future of semiconductors. We are seeking a motivated Process Integration Engineer to join our BEOL (Back-End-Of-Line) team within DRAM Research & Development.

This role is ideal for recent graduates or early-career engineers who are eager to develop deep expertise in semiconductor process integration, metallization, and interconnect technologies. You will work alongside experienced integration engineers to develop, optimize, and transfer advanced DRAM BEOL process flows. Strong fundamentals in materials science, electrical engineering, or a related discipline are essential. Prior semiconductor experience is valued but not required — we invest in developing our engineers. Responsibilities Support BEOL process flow development, optimization, and integration for advanced DRAM technologies.

Assist in troubleshooting integration issues across multiple process modules (metallization, dielectrics, etch, CMP). Collect, analyze, and interpret process and electrical data to drive yield improvement and reliability enhancement including the use of Agentic AI modeling Collaborate with cross-functional teams (module engineers, device engineers, reliability, manufacturing) to resolve technical challenges. Participate in technology transfer activities from R&D to pilot production. Document findings and present results to peers and leadership. Learn and apply statistical analysis tools and methodologies (JMP, Python, R, or equivalent).

Support pathfinding efforts for next-generation BEOL architectures and materials.

Minimum Qualifications

MS/PhD (preferred)/BS (required) in Electrical Engineering, Materials Science, Chemical Engineering, Microelectronics, Physics, Chemistry, or related field along with coursework or research in thin films, interconnect technology, or nanofabrication. Foundational understanding of semiconductor fabrication processes (thin film deposition, etch, lithography, CMP). Familiarity with BEOL concepts: metallization, interconnects, dielectrics, barrier/liner films. Hands-on experience with deposition techniques (CVD, ALD, PVD) or etch processes. Exposure to DRAM or memory device technology paired with experience with process integration, yield improvement, or reliability testing.

Preferred Qualifications

Internship or co-op experience in a semiconductor fab or R&D environment. Willingness to learn, adapt, and work in a fast-paced R&D environment paired with proficiency in statistical analysis tools: AI tool such as Claude Code…etc Familiarity with characterization techniques: SEM, TEM, XRD, electrical testing. Experience with DOE (Design of Experiments) methodology. Knowledge of semiconductor reliability concepts (electromigration, TDDB, stress migration). As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.

We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits . Micron is proud to be an equal opportunity workplace and is an affirmative action employer.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here.

To learn more about Micron, please visit micron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert : Candidates are encouraged to use AI tools to enhance their resume and/or application materials.

However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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Common questions

Does Micron Technology sponsor H-1B visas?

Micron Technology has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Sr BEOL Engineer - DRAM Process Integration role. Confirm with the employer before applying if visa support is required.

Where is the Sr BEOL Engineer - DRAM Process Integration role at Micron Technology based?

This role is based in Boise, ID.

What degree is required for the Sr BEOL Engineer - DRAM Process Integration role at Micron Technology?

The posting accepts the following combinations: BS + 0 years, MS + 0 years, PhD + 0 years.

How many years of experience does this Sr BEOL Engineer - DRAM Process Integration role require?

The posting calls for at least 0 years of relevant experience.

What polymers or materials does this Sr BEOL Engineer - DRAM Process Integration role work with?

dielectrics, barrier/liner films, metallization/interconnect metals.

What techniques or methods are required for this Sr BEOL Engineer - DRAM Process Integration role?

SEM, electrical testing, DOE.