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MTS 3D Heterogenous Integration Engineer

GlobalFoundries · Essex Junction, VT1mo agoverified 17 h ago
$98k – $176k

MS-level Process Engineering roles on Crosslinked list a median of $155k (32 that show pay).

Lead 3D heterogeneous integration process development: hybrid bonding, TSVs, interposers for advanced packaging

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Worth knowing

Why it is interesting. Own 3D heterogeneous integration in GF's Advanced Packaging Lab, working directly with tool and material vendors on hybrid bonding.

Might not be for you. Semiconductor process integration, not polymer science — cleanroom-heavy and requires deep BEOL/TSV background.

Mostly at the benchDeep specialist PhD-friendlySenior hires only Files patents regularly

Adjacent materials rolewafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, TSV/TOV, and interposer development; BEOL processes and integration

H-1B filings

GlobalFoundries filed 58 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Sr Engineer Process Engineering, Sr Engineer Integration Engineering, Principal Eng Equipment Engineering. Median filed pay: $102K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority
Senior
Work
On-site
Type
Full-time
Degree
MS
Experience
5–6 yrs
Industry
Semiconductor
Role
Process Engineering
Materials
wafer bonding materialsTSV/TOV metallurgyinterposer materials

Role details

About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role: GlobalFoundries Fab8 is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives, such as wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, TSV/TOV, and interposer development. Essential Responsibilities: Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g. , multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.).

Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs. Collaborate joint development projects with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes. Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs. Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources. Drive data analysis, interpretation of results, and understanding of failure modes. Identify and resolve process integration issues and related challenges.

Generate IP related to novel wafer integration and packaging technology. Other Responsibilities: Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Participate in hiring activities. Mentor and guide new hires to assume their roles and responsibilities. Other duties as assigned by manager.

Required Qualifications

Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. MS degree with at least 5-6 years of prior related work experience. In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly. Strong problem solving and technical trouble shooting skills including expertise in design of experiment.

Must have

at least an overall 3.0 GPA and proven good academic standing. Language Fluency - English (Written & Verbal). Travel - Up to 20%.

Preferred Qualifications

Education – PhD education level preferred with at least 3-4 years of prior related work experience. Demonstrated prior leadership experience internally or with an OSAT eco-system. Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. Strong written and verbal communication skills. Strong planning and organizational skills. Expected Salary Range $98,000.00 - $176,000.00 The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address. An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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Common questions

What is the salary for the MTS 3D Heterogenous Integration Engineer role at GlobalFoundries?

The listed annual base salary range is $98K–$176K. This figure is taken from the posting itself.

Where is the MTS 3D Heterogenous Integration Engineer role at GlobalFoundries based?

This role is based in Essex Junction, VT.

What degree is required for the MTS 3D Heterogenous Integration Engineer role at GlobalFoundries?

The posting accepts the following combinations: MS + 5 years, PhD + 3 years.

How many years of experience does this MTS 3D Heterogenous Integration Engineer role require?

The posting calls for 5–6 years of relevant experience.

What polymers or materials does this MTS 3D Heterogenous Integration Engineer role work with?

wafer bonding materials, TSV/TOV metallurgy, interposer materials.

What techniques or methods are required for this MTS 3D Heterogenous Integration Engineer role?

design of experiment, process integration, failure mode analysis.