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Integration Engineer Development EoPM

onsemi · Hopewell Junction, NY1mo agoverified 8 h ago
$114k – $194k

BS-level Process Engineering roles on Crosslinked list a median of $112k (561 that show pay).

Drive semiconductor advanced packaging integration, yield improvement, and new product/technology ramp to volume.

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Worth knowing

Why it is interesting. Own novel insulator integration and chip-scale module construction for power FETs at a major automotive/industrial semiconductor maker.

Might not be for you. Requires 6-10+ years of semiconductor integration experience; cleanroom-based, production-ramp focused rather than open-ended R&D.

Deep specialist Senior hires only

Adjacent materials roleNovel Insulator integration into wafer packaging; polyimide, RDL, advanced packaging integration, copper plating, sintering, CSP

Seniority
Senior
Work
On-site
Type
Full-time
Degree
BS
Experience
6–10 yrs
Industry
Semiconductor
Role
Process Engineering
Materials
Benefits
equity/stock

Role details

Job Description

onsemi

is seeking a highly motivated engineer to join our Technology Development group as an Integration Engineer at our Hopewell Junction, NY site. This will include driving continuous improvement on new processes, new product architecture and technologies, Yield and Performance improvements, and New Product/Technology Introduction and ramp to volume manufacturing.

Responsibilities

Essential Responsibilities

  • New Product Development: Support product development from initial design through full-scale manufacturing, ensuring complete documentation for ONSEMI’s process change review process.
  • Process Optimization: Collaborate with Manufacturing Engineering to recommend and implement manufacturable process recipes that meet yield and reliability targets.
  • Technical Expertise:
  • Demonstrate understanding of semiconductor technology, device physics, yield improvement, and manufacturing processes.
  • Novel Insulator integration into wafer packaging.
  • Chip Package Interaction (CPI) experience is a plus.
  • Chip-scale module construction.
  • Power FET experience, Power Module experience.
  • Experience with copper plating and wafer thinning is a plus.
  • Key skills/experience for this position are Pick-and-place, sintering, CSP, and advanced packaging.
  • Additional skills/experience for this position are RDL, advanced packaging integration, polyimide, dicing, and module assembly.
  • Data Analysis & Tools:
  • Proficiency in MS Excel, PowerPoint, Word, and MS Project.
  • Skilled in yield analysis tools such as Shiny, Excensio, JMP, Minitab, etc.
  • Automation processing software such as SiView.
  • Cross-Functional Collaboration:
  • Work effectively within a global matrixed team and independently drive projects to completion.
  • Communicate clearly with all levels of the organization, including executive leadership.
  • Execution & Leadership:
  • Operate independently, translating high-level objectives into detailed execution plans.
  • Act as a team player with strong listening skills, able to incorporate input and make informed decisions.

Qualifications

Required Qualifications

  • Education: BS in Engineering or Materials Science, MS+ preferred
  • Experience: 6-10 years or more of relevant experience in semiconductor manufacturing integration and technology development.
  • Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA
  • Language Fluency – Fluent in English Language, written & verbal

*Salary:*

onsemi is excited to share the base salary range for this position is$114,000 to $193,700 exclusive of fringe benefits or potential bonuses.The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf

About Us

onsemi

(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

onsemi

is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.

If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact Talent.acquisition@onsemi.com for assistance.

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Common questions

What is the salary for the Integration Engineer Development EoPM role at onsemi?

The listed annual base salary range is $114K–$194K. This figure is taken from the posting itself.

Where is the Integration Engineer Development EoPM role at onsemi based?

This role is based in Hopewell Junction, NY.

What degree is required for the Integration Engineer Development EoPM role at onsemi?

This role requires a BS.

How many years of experience does this Integration Engineer Development EoPM role require?

The posting calls for 6–10 years of relevant experience.

What polymers or materials does this Integration Engineer Development EoPM role work with?

polyimide, copper.

What techniques or methods are required for this Integration Engineer Development EoPM role?

SPC, DOE, FMEA, yield analysis.