What is the salary for the Senior Package Reliability Engineer role at Altera?

The listed annual base salary range is $167K–$240K. This figure is taken from the posting itself.

Where is the Senior Package Reliability Engineer role at Altera based?

This role is based in San Jose, CA.

How many years of experience does this Senior Package Reliability Engineer role require?

The posting calls for at least 8 years of relevant experience.

What polymers or materials does this Senior Package Reliability Engineer role work with?

substrate materials, assembly materials.

One of 4,529 polymer and materials roles on Crosslinked, each read for materials, degree, visa and salary. See roles like this

Senior Package Reliability Engineer

Q: What techniques or methods are required for this Senior Package Reliability Engineer role?

finite element modeling, thermal/thermomechanical characterization, warpage and coplanarity measurement, reliability stress testing, failure analysis.

Altera · San Jose, CA1w ago

$167k – $240kfrom the posting

MS-level R&D / Research roles on Crosslinked list a median of $130k (68 that show pay).

Model and qualify 2.5D/3D semiconductor package thermomechanical reliability and materials selection

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Electronic materials · R&D / Research roles, by email

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Worth knowing

Why it is interesting. Own thermomechanical FEM and materials selection for advanced 2.5D/3D heterogeneous packages at a pure-play FPGA leader.

Might not be for you. Requires 8+ years semiconductor package simulation; heavily modeling/standards-focused rather than polymer formulation.

Bench and deskDeep specialist Senior hires only

Adjacent materials roleselection of packaging materials based on thermal and thermomechanical characterization; substrate and assembly materials

H-1B filings

Altera filed 9 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Product Development Engineer, Product Quality and Reliability Engineer, Senior Design Verification Engineer. Median filed pay: $161K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority: Senior
Work: On-site
Type: Full-time
Degree: MS
Experience: 8+ yrs
Industry: Semiconductor
Role: R&D / Research

Materials

substrate materials2 roles assembly materials1 role

Techniques

finite element modeling5 rolesthermal/thermomechanical characterizationwarpage and coplanarity measurementreliability stress testing1 role failure analysis111 roles

Role details

Job Details

Job Description

About Altera

At Altera™, our independence as the world’s largest pure‑play FPGA solutions provider gives us the focus, speed, and agility to innovate without compromise. With more than four decades of industry‑leading FPGA expertise, our singular mission is to deliver the programmable technologies that help customers differentiate, innovate, and scale across rapidly evolving markets like AI, cloud, networking, and edge. As an independent company, we move faster, invest deeper, and partner more closely—empowering our teams to drive breakthrough innovation and shape the future of the FPGA industry.

About The Role

We are seeking an experienced semiconductor Package Reliability Engineer responsible for characterizing and qualifying advanced 2.5D/3D semiconductor packages. This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical characterization for advanced packaging technologies.

Key Responsibilities

Partner with package development and assembly teams for packaging materials (substrate, and assembly materials) selection to meet product thermomechanical reliability requirements
Develop and maintain advanced semiconductor package thermal and thermomechanical finite element models using commercial software (e.g., Ansys, Abaqus)
Define, execute and interpret package coplanarity, warpage, and second level reliability data collection strategies to calibrate the thermal and thermomechanical FEM models
Lead package reliability evaluations to validate package robustness as defined by industry standards such as JEDEC, MIL-STD, IPC, and AEC using test-chips and products
Understand FPGA use conditions and develop customer reports, communications related to package thermal and thermomechanical concerns.
Perform reliability lifetime prediction modeling from stress test/field data
Develop and own package DFMEA/FMEA’s partnering with development and manufacturing teams

Salary Range

The pay range below is for Bay Area California only. Actual salary may vary based on a number of factors including job location, job-related knowledge, skills, experiences, trainings, etc. We also offer incentive opportunities that reward employees based on individual and company performance.

$166,900 - $240,000 USD We use artificial intelligence to screen, assess, or select applicants for the position. Applicants must be eligible for any required U.S. export authorizations.

Qualifications

Minimum Qualifications

Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or a related technical field with 8+ years of experience in semiconductor package thermal and thermomechanical analysis
8+ years of experience using thermal and thermomechanical simulation tools (e.g., Ansys, Abaqus, COMSOL, or equivalent) to develop and analyze warpage, coplanarity, stress, and deformation models for advanced semiconductor packages.
8+ years of experience developing, analyzing, and validating advanced semiconductor packaging technologies, including 2.5D, 3D, and heterogeneous integration packages, with a strong understanding of package reliability.
3+ years of experience applying reliability statistics, failure analysis methodologies, and lifetime modeling techniques to semiconductor packaging and product reliability assessments.
3+ years of experience developing scripts or software using Python for automation, simulation workflows, data analysis, and post-processing.

Preferred Qualifications

Deep understanding of thermal, mechanical and thermomechanical characteristics of advanced 2.5D/3D flip-chip packages
Ability to correlate between thermomechanical simulations and package dynamic warpage and package behavior in surface mount system level assembly
Develop customer facing collaterals for packaging risk assessments

Job Type

Regular

Shift

Shift 1 (United States of America)

Primary Location

San Jose, California, United States

Additional Locations

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.