What is the salary for the C2C Bonding - BEOL Module Integration Engineer role at Samsung Austin Semiconductor?

The listed annual base salary range is $106K–$145K. This figure is taken from the posting itself.

Does Samsung Austin Semiconductor sponsor H-1B visas?

Samsung Austin Semiconductor has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the C2C Bonding - BEOL Module Integration Engineer role. Confirm with the employer before applying if visa support is required.

Where is the C2C Bonding - BEOL Module Integration Engineer role at Samsung Austin Semiconductor based?

This role is based in Austin, TX.

How many years of experience does this C2C Bonding - BEOL Module Integration Engineer role require?

The posting calls for at least 5 years of relevant experience.

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H-1B history

C2C Bonding - BEOL Module Integration Engineer

Samsung Austin Semiconductor · Austin, TX4w agoverified 8 h ago

$106k – $145k

BS-level Process Engineering roles on Crosslinked list a median of $112k (561 that show pay).

Lead C2C wafer bonding process development and BEOL module integration for CMOS image sensors

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Electronic materials · Process Engineering roles, by email

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Worth knowing

Why it is interesting. Own a 1st-of-a-kind C2C hybrid bonding process enabling stacked image sensors — rare greenfield fab integration work.

Might not be for you. Requires 5+ years Far BEOL integration plus 3+ years bonding — deep semiconductor fab experience, not entry-level.

Bench and deskDeep specialist Senior hires only

Adjacent materials roleC2C bonding, farBEOL module integration, Thin Films Deposition, CMP, wafer bonding processes

H-1B filings

Samsung Austin Semiconductor filed 63 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Engineer II, Engineer I, Senior Engineer. Median filed pay: $96K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority: Senior
Work: On-site
Type: Full-time
Degree: BS
Experience: 5+ yrs
Industry: Semiconductor
Role: Process Engineering

Materials

copper11 roles thin films77 roles

Benefits

401(k) matching with immediate vestingonsite café and workout facilitiespaid maternity and paternity leave

Role details

About Samsung Austin Semiconductor

Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow.

Come innovate with us!

Position Summary

In your role as a Copper-to-Copper (C2C) Bonding Expert, you'll be responsible to lead the development, optimization, and manufacturing integration of advanced wafer bonding technologies for next-generation CMOS Image Sensors (CIS).

You'll use your expertise to drive innovations in hybrid bonding processes enabling stacked image sensors with superior yield, performance and reliability.

Role And Responsibilities

Here's what you'll be responsible for

Enable 1st of a kind C2C bonding process at Samsung Austin - Own Module Integration for Bonding and farBEOL steps within the Process flow.
Own all Systematic Yield/Reliability related issues for these steps.
Lead projects to cure these systematics from the technology and/or improve detection for them.
Own critical dimension targeting and variation control within the Module.
Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.
Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.

Skills And Qualifications

Here's what you'll need:

Bachelor’s Degree (or higher) in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field
5+ years of experience in Far BEOL Process/Module Integration in semiconductor manufacturing + 3+ years of Bonding experience is required. 10+ years of experience in Process/Module Integration highly preferred.
Expert understanding of overall process flow in assigned areas - Demonstrated understanding of the interactions between process and yield, product performance and reliability.
Prior knowledge in fab unit processes (including Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, etc.) highly preferred.

*The current base salary range for this role is between $106,000.00 - $145,000.00. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.*

Total Rewards

At Samsung Austin Semiconductor, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.

We offer a comprehensive benefits package, including:

Medical, dental, and vision insurance
Life insurance and 401(k) matching with immediate vesting
Onsite café(s) and workout facilities
Paid maternity and paternity leave
Paid time off (PTO) + 2 personal holidays and 10 regular holidays
Wellness incentives and MORE

Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.

All positions at Samsung Austin Semiconductor are full-time on-site.

U.S. Export Control Compliance

This role may require access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.

Trade Secrets Notice

By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.

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Samsung Electronics America, Inc. and its subsidiaries are committed to Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, status as a qualified individual with a disability, or any other characteristic protected by law.