What is the salary for the Fabrication Backend Process Engineer, Quantum AI role at Google?

The listed annual base salary range is $108K–$153K. This figure is taken from the posting itself.

Does Google sponsor H-1B visas?

Google has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Fabrication Backend Process Engineer, Quantum AI role. Confirm with the employer before applying if visa support is required.

Where is the Fabrication Backend Process Engineer, Quantum AI role at Google based?

This role is based in Goleta, CA.

How many years of experience does this Fabrication Backend Process Engineer, Quantum AI role require?

The posting calls for at least 1 years of relevant experience.

What techniques or methods are required for this Fabrication Backend Process Engineer, Quantum AI role?

SEM, XPS, Interferometry, Electrical test (Probing).

One of 4,529 polymer and materials roles on Crosslinked, each read for materials, degree, visa and salary. See roles like this

H-1B history

Fabrication Backend Process Engineer, Quantum AI

Q: What polymers or materials does this Fabrication Backend Process Engineer, Quantum AI role work with?

bump materials, bonding materials.

Google · Goleta, CA2w agoverified 10 h ago

$108k – $153kfrom the posting

BS-level Process Engineering roles on Crosslinked list a median of $112k (561 that show pay).

Develop and sustain die singulation, hybridization, and advanced packaging processes for quantum processors

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Electronic materials · Process Engineering roles, by email

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Worth knowing

Why it is interesting. Hands-on advanced packaging for quantum computing at Google, with in-house SEM/XPS metrology and a 15% bonus target.

Might not be for you. Cleanroom-heavy backend process work with equipment troubleshooting; not open-ended materials R&D.

Mostly at the benchDeep specialist First industry roleBS acceptable

Adjacent materials roledeveloping novel bump materials, flip-chip bonding, structural bonding solutions; SEM, XPS characterization

H-1B filings

Google filed 100 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Manufacturing Engineer, Program Manager, Technical Program Manager. Median filed pay: $187K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority: Mid-level
Work: On-site
Type: Full-time
Degree: BS
Experience: 1+ yrs
Industry: Electronics
Role: Process Engineering

Materials

bump materialsbonding materials1 role

Techniques

SEM151 roles XPS43 roles Interferometry5 rolesElectrical test (Probing)Confocal microscopy3 roles

Benefits

equity/stock15% bonus target

Role details

Minimum qualifications

Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
1 year of experience in a wafer level or die level cleanroom environment.
1 year of experience with one or more of the following: SPC (statistical process control), Electrical test (Probing), Metrologies (SEM, XPS, Interferometry), or Failure analysis.
1 year of experience in hybridization techniques, including flip chip bonding, die handling and post bonding measurement.

Preferred qualifications

Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
Experience with developing novel bump materials, scaling up die sizes, flip-chip bonding or designing robust structural bonding solutions.
Experience with characterization techniques including SEM, XPS, confocal microscopy, and interferometry.
Experience with statistical process control and failure analysis activities.
Experience with data analysis and visualization tools such as JMP, Python, or SQL.

About The Job

As a fabrication backend process engineer you will play a role in the development and manufacturing of our cutting-edge quantum processor devices. You will be responsible for the die singulation process, die cleaning process, hybridization process, and device characterization modules. Your expertise will be crucial in developing robust, scalable bonding processes and die preparation processes that meet the quality standards. You will collaborate closely with cross-functional teams, including design, test, integration and frontend engineers, to optimize device performance, yield, and reliability.

Additionally, you will play a key role in the qualification of equipment and processes to establish and maintain a state-of-the-art advanced packaging technique.

The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.

Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $108000 - $153000 (USD) + 15% bonus target + equity + benefits

Responsibilities

Learn more about benefits at Google .

Partner closely with other teams (e.g., design, test, frontend, packaging) to integrate new backend modules into devices, develop and refine device probing, packaging, and measurement methodologies, and ensure successful product delivery and customer satisfaction.
Lead the sustainment and development of die singulation, die preparation, device hybridization modules and device characterization.
Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals.
Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations.
Analyze process data to identify trends, improve stability, and drive continuous yield improvement.

Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google's EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form .