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Principal Laser Packaging Engineer (Semiconductor Venture)

Q: What is the salary for the Principal Laser Packaging Engineer (Semiconductor Venture) role at TopoLight?

The listed annual base salary range is $135K–$165K. This figure is taken from the posting itself.

TopoLight6d ago

$135k – $165kfrom the posting

BS-level Product Development roles on Crosslinked list a median of $118k (200 that show pay).

Own packaging of high-power photonic crystal lasers from die-attach to tape-out.

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Worth knowing

Why it is interesting. Own the full package architecture for novel PCSELs, from thermal path design to manufacturable tape-out.

Might not be for you. Requires demonstrated high-power CW semiconductor laser packaging experience — not an entry-level or polymer-focused role.

Deep specialistFast-paced Senior hires only

Adjacent materials roledie-attach and bonding strategy, thermal path, submount, heat-spreader; packaging high-power CW semiconductor lasers

Seniority: Staff/Principal
Work: On-site
Type: Full-time
Degree: BS
Industry: Semiconductor
Role: Product Development

Benefits

equity/stock

Role details

Principal Laser Packaging Engineer

TopoLight is a venture-backed deep tech startup commercializing novel high-power photonic crystal lasers (PCSELs).

We’re looking for a principal engineer who will own the packaging of our laser module. You’ll take a high-power laser die from concept to a manufacturable, taped- out package. You’ll own the thermal path, the die-attach and bonding strategy, and the integration that determines whether the device meets its wavelength, efficiency, and reliability targets, and drive it through assembly and characterization to make it real.

*Note: This job posting was placed by Liminal, we're the venture builder that is backing TopoLight.*

Responsibilities

Own the laser package architecture from concept through tape-out
Design the thermal path, from die-attach to the submount, heat-spreader and cooler
Translate device performance targets into a manufacturable package that holds emission wavelength and efficiency across the range of operation
Model the thermal and mechanical behavior of the device and correlate against measured junction temperature, wavelength, and rollover
Debug and iterate problems quickly in a fast-moving environment

Qualifications

B.S. or M.S. in EE, Materials Science, Physics, Mechanical or Optical Engineering, or equivalent, with hands-on laser or optoelectronic packaging experience
Demonstrated experience packaging high-power CW semiconductor lasers
Has taken at a laser die from concept to a taped-out, working package
Solid understanding of how thermals impact and drive laser behavior
Comfortable owning ambiguous problems in a startup environment
Strong written and verbal communication, with a collaborative working style

Compensation

As a principal engineer, you will receive a significant stake of equity in TopoLight. Salary will

range from $135k - $165k based on experience, with a large stock allotment.