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CAE Engineer

Molex · Lisle, IL4w agoverified 51 min ago
$80k – $140kfrom the posting

BS-level Process Engineering roles on Crosslinked list a median of $112k (561 that show pay).

Perform FEA simulations and optimization for high-speed interconnect products using LS-DYNA and Abaqus.

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Worth knowing

Why it is interesting. Work on high-speed interconnect products for datacom, with opportunities to publish patents and papers.

Might not be for you. Simulation-heavy role with no lab work; may be less hands-on for materials scientists.

Computational or deskDeep specialist PhD-friendlyBS acceptable

Adjacent materials rolenonlinear structural finite element analysis (FEA) for short fiber reinforced plastic & copper alloy-based high-speed interconnect systems

Seniority
Mid-level
Work
On-site
Type
Full-time
Degree
BS
Experience
1+ yrs
Industry
Electronics
Role
Process Engineering
Schedule
Standard
Visa
No sponsorship
Materials
short fiber reinforced plasticscopper alloys2 roles
Techniques
FEA85 rolesnonlinear structural analysismolding simulation
Benefits
educational assistancepaid parental leaveadoption assistance

Role details

Your Job

We are seeking an enthusiastic and motivated CAE Engineer to join our team, performing structural simulations and optimization for datacom interconnect products. This role requires design, analysis, and optimization of innovative high-speed interconnect products for datacom applications.

In this role you will have the opportunity to perform advanced FEA simulations and optimizations on Molex products.

Our Team

At Molex, we create connections for life by enabling technologies that transform the future and improve lives. With a presence in more than 40 countries, we offer a complete range of connectivity products, services, and solutions across various industries, including data communications, medical, industrial, automotive, and consumer electronics.

Our Datacom and Specialty Solutions (DSS) team specializes in providing high speed connector solutions essential for building reliable communications equipment, catering to telecommunications, datacom, hyperscalers, cloud, data center, and storage applications. We continue to innovate to meet the demands of next-generation markets.

What You Will Do

  • Conduct and coordinate nonlinear structural finite element analysis (FEA) for short fiber reinforced plastic & copper alloy-based high-speed interconnect systems, through Hypermesh & LS-DYNA tools or Abaqus tools.
  • Deliver reliable FEA results in a timely manner and effectively communicate them with product design engineers through clear written and verbal presentations.
  • Provide design recommendations to improve and optimize product structural performance based on FEA results, ensuring that design targets are met.
  • Participate in the correlation of CAE simulations to real-world tests and improve existing modeling methods as needed.
  • Develop new FEA techniques and modeling methods, working both independently and collaboratively with vendors to improve their accuracy and efficiency.
  • Lead the development of new products and oversee the activities of global teams, ensuring alignment with engineering management priorities.
  • Publish technical papers and patents.

Who You Are (Basic Qualifications)

  • B.S. Degree in Mechanical or Related Engineering Discipline.
  • 1+ years’ experience with parametric CAD systems (UG NX, CATIA, SolidWorks, etc.)
  • 1+ years’ experience with LS-DYNA, ABAQUS, or ANSYS Workbench simulation software.
  • 1+ years’ experience with Altair (Hypermesh/Hyperview) family products.
  • Proficiency in Python scripting for data processing, automation, or simulation integration.
  • Good communication and collaboration skills.

What Will Put You Ahead

  • M.S. or Ph.D. degree in Mechanical Engineering or a related engineering discipline.
  • 3+ years’ experience with CAE modeling applications in predicting nonlinear structural behavior on short fiber reinforced plastics & metals.
  • Experience with molding simulation software, e.g., Moldflow, Moldex-3D, Digimat, Converse, etc.
  • Hands-on experience with optimization software such as ModeFrontier, OptiSLang, or Isight.
  • Familiarity with machine learning and deep learning techniques, including physics-informed neural networks (PINNs).
  • Established records of publication such as patents and technical papers.

*This position does not qualify for VISA Sponsorship.* *For this role, we anticipate paying $80,000 - $140,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form.* *At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location.

If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy.*

Hiring Philosophy

All Koch companies value diversity of thought, perspectives, aptitudes, experiences, and backgrounds. We are Military Ready and Second Chance employers. Learn more about our hiring philosophy here.

Who We Are

As a Koch company, Molex is a leading supplier of connectors and interconnect components, driving innovation in electronics and supporting industries from automotive to health care and consumer to data communications. The thousands of innovators who work for Molex have made us a global electronics leader. Our experienced people, groundbreaking products and leading-edge technologies help us deliver a wider array of solutions to more markets than ever before.

At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company.

Our Benefits

Our goal is for each employee, and their families, to live fulfilling and healthy lives. We provide essential resources and support to build and maintain physical, financial, and emotional strength - focusing on overall wellbeing so you can focus on what matters most. Our benefits plan includes - medical, dental, vision, flexible spending and health savings accounts, life insurance, ADD, disability, retirement, paid vacation/time off, educational assistance, and may also include infertility assistance, paid parental leave and adoption assistance. Specific eligibility criteria is set by the applicable Summary Plan Description, policy or guideline and benefits may vary by geographic region.

If you have questions on what benefits apply to you, please speak to your recruiter.

Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results.

Equal Opportunities

Equal Opportunity Employer, including disability and protected veteran status. Except where prohibited by state law, some offers of employment are conditioned upon successfully passing a drug test. This employer uses E-Verify. Please click here for additional information. (For Illinois E-Verify information click here, aquí, or tu).

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Common questions

What is the salary for the CAE Engineer role at Molex?

The listed annual base salary range is $80K–$140K. This figure is taken from the posting itself.

Does Molex sponsor work visas for the CAE Engineer role?

This employer will not provide visa sponsorship for this role.

Where is the CAE Engineer role at Molex based?

This role is based in Lisle, IL.

What degree is required for the CAE Engineer role at Molex?

This role requires a BS.

How many years of experience does this CAE Engineer role require?

The posting calls for at least 1 years of relevant experience.

What polymers or materials does this CAE Engineer role work with?

short fiber reinforced plastics, copper alloys.

What techniques or methods are required for this CAE Engineer role?

FEA, nonlinear structural analysis.