HPHP
Polymer & materials science hiring snapshot · last 6 months
Open roles (8)
- Research & Development Ink Chemist Corvallis, OR· $93k – $144k
- Electrical/Hardware Engineering Intern Corvallis, OR· $94k – $108k
- PWI R&D Writing Systems Engineer Corvallis, OR· $93k – $135k
- Writing Systems Engineer Corvallis, OR· $83k – $128k
- Ink Technology Chemist San Diego, CA· $93k – $144k
- SEM Lab Technician Corvallis, OR· $60k – $89k
- Product Design Engineer - HPIQ San Francisco, CA· $107k – $156k
- Interactive Design Engineer - HPIQ San Francisco, CA· $107k – $156k
Degree requirements
Top material classes
Most-requested techniques
Role mix
Where they hire
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Work arrangement
Visa & eligibility signals
Sponsorship signals come from posting language plus historical DOL Labor Condition Application data. Confirm specifics with the recruiter.
H-1B filings for scientists and engineers
HP filed 8 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025, at a median filed pay of $107K a year.
| Title filed | Filings | Median filed pay |
|---|---|---|
| Experience Design Engineer | 3 | $96K |
| 3D Metal Printing - Services Competency Engineer | 1 | · |
| Engineer VI | 1 | · |
| Industrial Design Engineer 2 | 1 | · |
| Pss Life Cycle Marketing Professional 3 | 1 | · |
| Research Engineer | 1 | · |
By occupation: Industrial engineers 5 · Mechanical engineers 2 · Physicists 1. Worksites: CA 3 · TX 2 · WA 1.
From U.S. Department of Labor Labor Condition Application disclosure data, certified filings only, in chemist, materials, chemical and mechanical engineering, physics, R&D management and science faculty occupations. A filing is a record of past hiring, not a promise about any role. Pay shown needs 3 filings. Compare every employer's filings.
Posting volume · last 6 months
19 roles posted across 6 months, averaging 3.2/month.
